NC257MD solder paste has been specifically designed for the Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing to provide continuous and consistent deposits. NC257MD provides the necessary tack time and force for today’s high speed placement equipment, which will enhance product performance and reliability. The superior wetting ability of NC257MD results in bright, smooth and shiny solder joints. It also offers very low post process residues, which remain crystal clear and easily probed even at the elevated temperatures required for today’s lead-free alloys.